On Bonded Circular Inclusions in Plane Thermoelasticity
Author:
Affiliation:
1. Department of Mechanical Engineering, National Taiwan Institute of Technology, Taipei, Taiwan 106, Republic of China
2. Department of Mechanical Engineering, Nankai Jr. College of Technology, Nantou, Taiwan, Republic of China
Abstract
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics
Link
http://asmedigitalcollection.asme.org/appliedmechanics/article-pdf/64/4/1000/5464873/1000_1.pdf
Reference11 articles.
1. Bogdanoff J. L. , 1954, “Note on Thermal Stress,” ASME JOURNAL OF APPLIED MECHANICS, Vol. 21, p. 8888.
2. Chao C. K. , and LeeJ. Y., 1996, “Interaction Between a Crack and a Circular Elastic Inclusion Under Remote Uniform Heat Flow,” Int. J. Solids Structures, Vol. 33, pp. 3865–3880.
3. Chen W. T. , 1967, “Plane Thermal Stress at an Insulated Hole Under Uniform Heat Flow in an Orthotropic Medium,” ASME JOURNAL OF APPLIED MECHANICS, Vol. 34, pp. 133–136.
4. Florence A. L. , and GoodierJ. N., 1959, “Thermal Stress at Spherical Cavities and Circular Holes in Uniform Heat Flow,” ASME JOURNAL OF APPLIED MECHANICS, Vol. 26, pp. 293–294.
5. Florence A. L. , and GoodierJ. N., 1960, “Thermal Stress Due to Disturbance of Uniform Heat Flow by an Insulated Ovaloid Hole,” ASME JOURNAL OF APPLIED MECHANICS, Vol. 27, pp. 635–639.
Cited by 29 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. The plane elasticity problem of interface cracks between three-dimensional icosahedral quasicrystals and circular elastic inclusion under the thermal loading;2023-03-02
2. A novel hybrid technique to decompose in-plane thermoelastic displacement fields into thermal and structural displacement fields;Acta Mechanica;2022-08-18
3. Thermal stress analysis for a hypocycloid-type crack problem under remote thermal loading;Journal of Thermal Stresses;2021-02-22
4. Stress intensity factors for cusp-type crack problem under mechanical and thermal loading;Journal of Mechanics;2021
5. Closed‐form solutions for a circular inhomogeneity in nonlinearly coupled thermoelectric materials;ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik;2019-06-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3