Characteristics of Flow Boiling Oscillations in Silicon Microchannel Heat Sinks
Author:
Affiliation:
1. Department of Mechanical and Industrial Engineering, Concordia University, Montréal, QC, H3G 1M8, Canada
2. Washington Technology Center, Seattle, WA 98195-2140
Abstract
Publisher
ASME International
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
http://asmedigitalcollection.asme.org/heattransfer/article-pdf/129/10/1341/5495350/1341_1.pdf
Reference31 articles.
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4. A Practical Implementation of Silicon Microchannel Coolers for High Power Chips;Colgan
5. Thermal-Hydraulic Performance of MEMS-Based Pin Fin Heat Sink;Kosar;ASME J. Heat Transfer
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