Three-Dimensional Printing of Highly Conducting PEDOT: PSS-Based Polymers

Author:

Wang Xinnian1,Plog Jevon1,Lichade Ketki M.1,Yarin Alexander L.23,Pan Yayue1

Affiliation:

1. University of Illinois at Chicago Department of Mechanical, and Industrial Engineering, , Chicago, IL 60607

2. University of Illinois at Chicago Department of Mechanical, and Industrial Engineering, , Chicago, IL 60607 ;

3. School of Mechanical Engineering , Korea University, Seoul 136-713 , South Korea

Abstract

Abstract Poly(3,4-ethylenedioxythiophene):poly(styrenesulfonic acid) (PEDOT:PSS) is one of the most successful conducting polymers for electronic applications. Most commonly, the spin coating process is used to fabricate PEDOT:PSS thin films from an aqueous solution, yet it is unsuitable for fabricating complicated two-dimensional (2D) structures. Extrusion-based additive manufacturing (AM) processes have been investigated for 3D printing PEDOT:PSS-based polymers with free-form architecture. However, such methods imply strict requirements on the rheological properties of materials and, as a result, have limited choices of appropriate materials. In the past, additives have been added to improve the 3D printing processability of PEDOT:PSS materials, which, however, usually deteriorate the electrical conductivity. This article reports a new type of PEDOT:PSS material capable of addressing the previously listed challenges and characterized by high processability and electrical conductivity (72 S/cm). In addition, a novel extrusion-based AM technology, electrostatically-assisted direct ink writing (eDIW), is investigated for printing materials containing PEDOT:PSS. The eDIW method prints lines at micro-scale resolution at an ultra-high speed (1.72 m/s). This combination is often deemed impossible in the framework of classical extrusion-based AM techniques. This work lays the foundation for future explorations of applications of PEDOT:PSS-based conducting polymers in fields that require superb properties and custom geometry, which were conventionally impossible.

Funder

National Science Foundation

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

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