MTPS Analytical Temperature and Heat Flux Solution With Thermal Contact Resistance-Reference-Cited by-同舟云学术

MTPS Analytical Temperature and Heat Flux Solution With Thermal Contact Resistance

Published:2022-05-11 Issue:7 Volume:144 Page:
ISSN:0022-1481
Container-title:Journal of Heat Transfer
language:en
Short-container-title:

Author:

Emanual Michael¹,Brown Brandon C.²,Ackermann Sarah L. G.³,Bateman Robert³

Affiliation:

1. VP Research and Development C-Therm Technologies, Fredericton, NB E3B 1B6, Canada

2. VP Engineering C-Therm Technologies, Fredericton, NB E3B 1B6, Canada

3. C-Therm Technologies, Fredericton, NB E3B 1B6, Canada

Abstract

Abstract An exact transient analytical solution of the temperature fields and heat fluxes for the modified transient plane source (MTPS) method is presented. The MTPS sensor is made of a thin disk with a heater/sensor and a heated guard ring on its surface, providing a one-dimensional heat flow to a semi-infinite sample in contact with its surface. The MTPS sensor measures the thermal effusivity of the sample. Two different solutions are derived, one is in the form of an infinite series with no thermal resistance, and the other is in integral form and includes thermal resistance between the MTPS sensor surface and the measured sample. The theoretical model is supplemented by experimental results.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://asmedigitalcollection.asme.org/heattransfer/article-pdf/144/7/071401/6879988/ht_144_07_071401.pdf

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