Rubber-Assisted Hot Embossing for Structuring Thin Polymer Film Polymeric Films

Abstract

Precision structured polymer thin films with microstructures comparable to or greater than the film thickness are highly desired in many applications. Such micro-patterned thin films, however, are difficult to fabricate using the standard hot embossing technology where both halves of the mold are made of hard materials. This study investigated a rubber-assisted embossing process for structuring thin polymer films. The advantages of the rubber backup instead of a hard support include but are not limited to 1) simplifying the embossing tool, 2) protecting the embossing master, 3) facilitating embossing pressure buildup, and 4) accommodating conformal forming of microscale shell patterns. Several design and process variables including rubber hardness, embossing temperature, embossing pressure and holding time were carefully studied. Thin polystyrene films in a thickness of 25 μm were accurately patterned with microgrooves of characteristic dimensions on the order of 100 μm.