Effects of Dwell-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints-Reference-Cited by-同舟云学术

Effects of Dwell-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints

Published:2004-01-01 Issue: Volume: Page:
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Container-title:Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
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Author:

Lau John¹,Dauksher Walter¹

Affiliation:

1. Agilent Technologies, Inc.

Abstract

The effects of temperature-cycling dwell-time on the thermal-fatigue life of lead-free solder joints are investigated in this study. Emphasis is placed on the determination of creep responses and the creep strain energy density per cycle of a PBGA (plastic ball grid array) package’s lead-free solder joints subjected to various dwell times (namely, 15, 60, and 480 minutes) at peak cycling temperatures (0°C and 100°C).

Publisher

ASMEDC

Link

http://asmedigitalcollection.asme.org/IMECE/proceedings-pdf/doi/10.1115/IMECE2004-62492/2619591/257_1.pdf

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