Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

Author:

Schmidt Roger1,Cruz Ethan1

Affiliation:

1. IBM Corporation, Poughkeepsie, NY 12601

Abstract

This paper focuses on the effect on rack inlet air temperatures as a result of maldistribution of airflows exiting the perforated tiles located adjacent to the fronts of the racks. The flow distribution exiting the perforated tiles was generated from a computational fluid dynamics (CFD) tool called Tileflow (trademark of Innovative Research, Inc.). Both raised floor heights and perforated tile-free areas were varied in order to explore the effect on rack inlet temperatures. The flow distribution exiting the perforated tiles was used as boundary conditions to the above-floor CFD model. A CFD model was generated for the room with electronic equipment installed on a raised floor. Forty racks of data processing (DP) equipment were arranged in rows in a data center cooled by chilled air exhausting from perforated floor tiles. The chilled air was provided by four A/C units placed inside a room 12.1 m wide×13.4 m long. Because the arrangement of the racks in the data center was symmetric, only half of the data center was modeled. The numerical modeling for the area above the raised floor was performed using a commercially available finite control volume computer code called Flotherm (trademark of Flomerics, Inc.). The flow was modeled using the k-e turbulence model. Results are displayed to provide some guidance on the design and layout of a data center.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. The Uptime Institute, “Heat Density Trends in Data Processing, Computer Systems and Telecommunication Equipment” (white paper), www.uptimeinstitute.org.

2. Schmidt, R., 2001, “Effect of Data Center Characteristics on Data Processing Equipment Inlet Temperatures,” Advances in Electronic Packaging 2001 (Proc. of IPACK ’01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), Kauai, July, ASME, New York, Vol. 2, ASME Paper No. IPACK2001-15870, pp. 1097–1106.

3. Schmidt, R., and Cruz, E., 2002, “Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures of Chilled Air Exiting Both the Hot and Cold Aisles,” Proceedings of Itherm Conference, San Diego, June, pp. 580–594.

4. Schmidt, R., and Cruz, E., 2002, “Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When High Powered Racks are Situated Amongst Lower Powered Racks,” IMECE Conference, New Orleans, Nov., ASME New York.

5. Schmidt, R., and Cruz, E., 2003, “Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When Adjacent Racks are Removed,” Interpack Conference, Maui, July (to be published).

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3