Optimal Design for PPF Heat Sinks in Electronics Cooling Applications

Author:

Chen Han-Ting1,Horng Jenn-Tsong1,Chen Po-Li1,Hung Ying-Huei1

Affiliation:

1. Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan

Abstract

An effective method for predicting and optimizing the thermal performance of heat sinks with Parallel-Plain Fin under a given design constraint of pressure drop has been successfully developed in the study. The thermal and hydrodynamic performance analyzers for PPF heat sinks have been developed. A screening experimental design using the Taguchi method is performed to determine key factors that are critical to the design and screen out unimportant design factors; and a Response Surface Methodology is then applied to establish analytical models for the thermal resistance and pressure drop in terms of the key design factors with a CCD experimental design. By employing the Sequential Quadratic Programming technique, a series of constrained optimal designs can be efficiently performed. Comparisons between these predicted optimal designs and those evaluated by the theoretical calculations are made with satisfactory agreement.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference17 articles.

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2. Ellison, G. N., 1989, Thermal Computations for Electronic Equipment, 2nd ed., Van Nostrand Reinhold Corporation, New York.

3. Knight, R. W., and Gooding, J. S., 1991, “Optimal Thermal Design of Forced Convection Heat Sinks-Analytical,” ASME J. Electron. Packag., 113, pp. 313–321.

4. Kraus, A. D., and Bar-Cohen, A., 1995, Design and Analysis of Heat Sinks, John Wiley and Sons, Inc., New York.

5. Ishizuka, M., Yokono, Y., and Hisano, K., 1999, “Experimental Study on The Performance of Compact Heat Sink for LSI Packages,” ASME Advances in Electronic Packaging, Vol. 26-1.

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