Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates
Author:
Affiliation:
1. Center for Advanced Materials, Lawrence Berkeley Laboratory and Department of Materials Science and Mineral Engineering, University of California, Berkeley, CA 94720
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/114/2/104/5667142/104_1.pdf
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1. Mechanical fatigue of Sn-rich Pb-free solder alloys;Journal of Materials Science: Materials in Electronics;2006-09-12
2. The microstructure characterization of ultrasmall eutectic Bi-Sn solder bumps on Au/Cu/Ti and Au/Ni/Ti under-bump metallization;Journal of Electronic Materials;2004-01
3. Influence of interfacial intermetallic compound on fracture behavior of solder joints;Materials Science and Engineering: A;2003-10
4. Microstructural effect on the creep strength of a Sn-3.5%Ag solder alloy;Journal of Electronic Materials;2003-01
5. Fundamentals of Solders and Soldering;Reflow Soldering Processes;2001
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