1. Technology Roadmap 2015—Technology Situation Analysis,2015
2. PCB Technology Trends 2016,2016
3. Assembly Guidelines for Land Grid Array (LGA) Package;NXP Semiconductor, Inc.,2015
4. Iyer, R. L., and Santos, D. L., 2015, “Understanding Market Trends for Fine Volume Dispensing in Electronics Assembly,” IIEAnnual Industrial Engineering and Research Conference, Nashville, TN, May 30–June 2, pp. 724–773.https://www.highbeam.com/doc/1P3-4070050761.html
5. Experimental and Modeling Study of Breakup Behavior in Silicone Jet Dispensing Process for Light-Emitting Diode Packaging;IEEE Trans. Compon., Packag., Manuf. Technol.,2015