Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment
Author:
Affiliation:
1. GE Global Research, One Research Circle, Niskayuna NY 12309
2. Rutgers University, Dept. Mechanical & Aerospace Eng., New Brunswick, NJ 08901, USA
3. Fellow, ASME
4. Rutgers University, Dept. Mechanical & Aerospace Eng., New Brunswick, NJ 08901
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/128/4/466/4985125/466_1.pdf
Reference27 articles.
1. Convection Heat Transfer in Electronic Equipment Cooling;Incropera;ASME J. Heat Transfer
2. A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages;Sathe;ASME J. Heat Transfer
3. Heat Transfer – A Review of 2000 Literature;Goldstein;Int. J. Heat Mass Transfer
4. Mixed Convection Transport From a Protruding Heat Source Module on a Vertical Surface;Kang;J. Thermophys. Heat Transfer
5. Mixed Convection Heat Transfer From Thermal Sources Mounted on Horizontal and Vertical Surfaces;Tewari;ASME J. Heat Transfer
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