Graphite Foam Thermal Management of a High Packing Density Array of Power Amplifiers
Author:
Affiliation:
1. ASME
2. Miltec Research and Technology, Oxford Enterprise Center & Industrial Park, Oxford, MS 38655
3. University of Mississippi, Department of Mechanical Engineering, University, MS 38677
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/128/4/456/5633803/456_1.pdf
Reference13 articles.
1. Cooling Technology Options, Part 1;Azar;Electronics Cooling
2. The Challenges of Electronic Cooling: Past, Current, and Future;Chu;ASME J. Electron. Packag.
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