Lateral Buckling of Interconnects in a Noncoplanar Mesh Design for Stretchable Electronics

Author:

Chen Chi1,Tao Weiming2,Su Yewang3,Wu Jian4,Song Jizhou5

Affiliation:

1. Department of Mechanical and Aerospace Engineering, University of Miami, Coral Gables, FL 33146

2. Institute of Applied Mechanics, Zhejiang University, Hangzhou 310027, China

3. Department of Mechanical Engineering and Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208; Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China

4. AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China; Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China

5. Department of Mechanical and Aerospace Engineering, University of Miami, Coral Gables, FL 33146 e-mail:

Abstract

Analytical models have been established to study the lateral buckling of interconnects under shear in a noncoplanar mesh design for stretchable electronics. Analytical expressions are obtained for the critical load and buckling shape at the onset of buckling by solving the equilibrium equations. The postbuckling behavior is studied by energy minimization of the potential energy, including up to fourth power of the displacement. A simple expression of the amplitude characterizing the deformation after buckling is obtained. These results agree well with the finite element simulations without any parameter fitting. The models in this paper may provide a route to study complex buckling modes of interconnects, such as diagonal compression/stretching involving both compression and shear.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics

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