Mechanics of Epidermal Electronics

Author:

Wang Shuodao1,Li Ming2,Wu Jian3,Kim Dae-Hyeong4,Lu Nanshu5,Su Yewang6,Kang Zhan7,Huang Yonggang8,Rogers John A.9

Affiliation:

1. Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208

2. State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, P. R. C.; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208

3. Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. C.

4. School of Chemical and Biological Engineering, Seoul National University, Seoul, 151-744, Korea

5. Department of Aerospace Engineering and Engineering Mechanics, University of Texas at Austin, Austin, TX 78705

6. Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208

7. State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, P. R. C.

8. Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208;Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208

9. Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801

Abstract

Epidermal electronic system (EES) is a class of integrated electronic systems that are ultrathin, soft, and lightweight, such that it could be mounted to the epidermis based on van der Waals interactions alone, yet provides robust, intimate contact to the skin. Recent advances on this technology will enable many medical applications such as to monitor brain or heart activities, to monitor premature babies, to enhance the control of prosthetics, or to realize human-machine interface. In particular, the contact between EES and the skin is key to high-performance functioning of the above applications and is studied in this paper. The mechanics concepts that lead to successful designs of EES are also discussed. The results, validated by finite element analysis and experimental observations, provide simple, analytical guidelines for design and optimization of EES with various possible functionalities.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics

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