Sliding Contact Between a Cylindrical Punch and a Graded Half-Plane With an Arbitrary Gradient Direction

Author:

Peijian Chen1,Shaohua Chen2,Juan Peng3

Affiliation:

1. School of Mechanics and Civil Engineering, State Key Laboratory for Geomechanics and Deep Underground Engineering, China University of Mining and Technology, Xuzhou, Jiangsu 221116, China

2. LNM, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China e-mail: ;

3. School of Sciences, China University of Mining and Technology, Xuzhou, Jiangsu 221116, China

Abstract

Contact behavior of a rigid cylindrical punch sliding on an elastically graded half-plane with shear modulus gradient variation in an arbitrary direction is investigated. The governing partial differential equations and the boundary conditions are achieved with the help of Fourier integral transformation. As a result, the present problem is reduced to a singular integral equation of the second kind, which can be solved numerically. Furthermore, the presently general model can be well degraded to special cases of a lateral gradient half-plane and a homogeneous one. Normal stress in the contact region is predicted with different material parameters, which is usually used to estimate the possibility of surface crack initiation. The moment that is needed to ensure stable sliding of the cylindrical punch on the contact surface is further predicted. The result in the present paper should be helpful for the design of novel graded materials with surfaces of strong abrasion resistance.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics

Reference31 articles.

1. Graded Materials for Resistance to Contact Deformation and Damage;Science,2001

2. Spherical Indentation of Compositionally Graded Materials: Theory and Experiments;Acta Mater.,1997

3. Hertzian-Crack Suppression in Ceramics With Elastic-Modulus-Graded Surfaces;J. Am. Ceram. Soc.,1998

4. Microhardness Studies on Functionally Graded Polymer Composites;Compos. Sci. Technol.,2001

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