Collocation Spectral Method for the Transient Conduction–Radiation Heat Transfer With Variable Thermal Conductivity in Two-Dimensional Rectangular Enclosure

Author:

Li Guo-Jun1,Ma Jian2,Li Ben-Wen3

Affiliation:

1. School of Materials and Metallurgy, Northeastern University, Shenyang 110819, China

2. Key Laboratory of National Education Ministry for Electromagnetic Processing of Materials, Northeastern University, Shenyang 110819, China

3. Institute of Thermal Engineering, School of Energy and Power Engineering, Dalian University of Technology, Dalian 116024, China e-mail: ;

Abstract

The collocation spectral method (CSM) is further developed to solve the transient conduction–radiation heat transfer in a two-dimensional (2D) rectangular enclosure with variable thermal conductivity. The energy equation and the radiative transfer equation (RTE) are all discretized by Chebyshev–Gauss–Lobatto collocation points in space after the discrete ordinates method (DOM) discretization of RTE in angular domain. The treatment of variable thermal conductivity is executed using the array multiplication. The present method can deal with different boundary conditions with high accuracy, the Dirichlet one and mixed one, for example. Based on our new method, the effects of several parameters on heat transfer processes are analyzed.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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