The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1—Data for Arrays of Flatpacks for Different Flow Conditions
Author:
Affiliation:
1. Dept. C71 Bldg. 701, IBM Corporation, P.O. Box 950, Poughkeepsie, NY 12602
2. Department of Mechanical Engineering, Stanford University, Stanford, California 94305
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/114/1/14/5580544/14_1.pdf
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