Use of the Kelvin-Clapeyron Equation to Model an Evaporating Curved Microfilm

Author:

DasGupta S.1,Kim I. Y.1,Wayner P. C.1

Affiliation:

1. The Isermann Department of Chemical Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180-3590

Abstract

A Kelvin–Clapeyron change-of-phase heat transfer model is used to evaluate experimental data for an evaporating meniscus. The details of the evaporating process near the contact line are obtained. The heat flux and the heat transfer coefficient are a function of the film thickness profile, which is a measure of both the intermolecular stress field in the contact line region and the resistance to conduction. The results indicate that a stationary meniscus with a high evaporative flux is possible. At equilibrium, the augmented Young–Laplace equation accurately predicts the meniscus slope. The interfacial slope is a function of the heat flux.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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