Cooling of High-Temperature Cylindrical Surfaces Using a Water–Air Spray

Author:

Buckingham F. P.1,Haji-Sheikh A.2

Affiliation:

1. Forney Corporation, P.O. Box 189, Addison, TX 75001

2. Department of Mechanical Engineering, The University of Texas at Arlington, Arlington, TX 76019-0023

Abstract

In materials processing such as heat treating, metal extrusion, forging, etc., control of the surface heat flux rate contributes to better products. Spray cooling using a mixture of water and air is studied for these applications. It is shown that the heat transfer rate depends on the mass fraction of liquid and that it can be adjusted to a desired value. Experimental heat flux data are presented for different liquid mass fractions, and at surface temperatures up to 1000°C. Two distinct heat transfer regions above the dry wall temperature are recognized: radiation-dominated and convection-dominated, where droplets evaporate in the boundary layer. In between these two regions is a transition region. The inverse thermal conduction technique based on the Monte Carlo simulation is used to provide surface temperature and subsequently to compute heat flux.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference28 articles.

1. Bird, R. B., Stewart, W. E., and Lightfoot, E. N., 1960, Transport Phenomena, Wiley, New York.

2. Buckingham, F. P., 1993, “Heat Transfer in Spray Cooling,” Ph.D. Dissertation, the University of Texas at Arlington.

3. Buckingham, F. P., and Haji-Sheikh, A., 1993, “Heat Transfer in Spray Cooling Using a Binary Flow With Change of Phase,” in: Transport Phenomena in Nonconventional Manufacturing and Materials Processing, ASME HTD-Vol. 259, pp. 33–41.

4. Chaudhury Z. H. , 1964, “Heat Transfer in a Radial Liquid Jet,” J. Fluid Mechanics, Vol. 20, pp. 501–511.

5. Choi K. J. , and YaoS. C., 1987, “Mechanisms of Film Boiling Heat Transfer of Normally Impacting Spray,” Int. J. Heat Mass Transfer, Vol. 30, No. 2, pp. 311–318.

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