The Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies
Author:
Affiliation:
1. Thermomechancial Solutions, and Packaging Development Department, Analog Devices, B.V., Limerick, Ireland
2. Department of Mechanical and Aeronautical Engineering, University of Limerick, Ireland
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/126/1/106/5558596/106_1.pdf
Reference11 articles.
1. Timoshenko, S. , 1925, “Analysis of Bi-Metal Thermostats,” J. Opt. Soc. Am., 11, pp. 233–255.
2. Hess, M. S. , 1969, “The End Problem for a Laminated Elastic Strip-I. The General Solution,” J. Compos. Mater., 3, pp. 262–280.
3. Hess, M. S. , 1969, “The End Problem for a Laminated Elastic Strip-II. Differential Expansion Stresses,” J. Compos. Mater., 3, pp. 630–641.
4. Suhir, E. , 1986, “Stresses in Bi-Metal Thermostats,” ASME J. Appl. Mech., 53, pp. 657–660.
5. Suhir, E., 1986, “Stresses in Adhesively Bonded Bi-material Assemblies Used in Electronic Packaging,” Electronic Packaging Materials Science 1986, Materials Research Soc., pp. 133–138.
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