The Effects of Material Properties on Heat Dissipation in High Power Electronics
Author:
Lu T. J.1, Evans A. G.2, Hutchinson J. W.2
Affiliation:
1. Department of Engineering, University of Cambridge, Cambridge CB2 1PZ England 2. Division of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138
Abstract
The role of the substrate in determining heat dissipation in high power electronics is calculated, subject to convective cooling in the small Biot number regime. Analytical models that exploit the large aspect ratio of the substrate to justify approximations are shown to predict the behavior with good accuracy over a wide range of configurations. The solutions distinguish heat spreading effects’ that enable high chip-level power densities from insulation effects that arise at large chip densities. In the former, the attributes of high thermal conductivity are apparent, especially when the substrate dimensions are optimized. Additional benefits that derive from a thin layer of a high thermal conductivity material (such as diamond) are demonstrated. In the insulating region, which arises at high overall power densities, the substrate thermal conductivity has essentially no effect on the heat dissipation. Similarly, for compact multichip module designs, with chips placed on both sides of the substrate, heat dissipation is insensitive to the choice of the substrate material, unless advanced cooling mechanisms are used to remove heat around the module perimeter.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Ashby, M. F., 1992, Materials Selection in Mechanical Design, Pergamon Press, Oxford. 2. Bar-Cohen, A., and Kraus, A. D., eds., 1988, Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1, Hemisphere, NY. 3. Beck
J. V.
, OsmanA. M., and LuG., 1993, “Maximum Temperatures in Diamond Heat Spreaders Using the Surface Element Method,” ASME Journal of Heat Transfer, Vol. 115, pp. 51–57. 4. Blodgett
A. J.
, and BarbourD. R., 1982, “Thermal Conduction Module: A High-Performance Multilayer Ceramic Package,” IBM J. Res. Develop., Vol. 26, pp. 30–36. 5. Evans, A. G., Hutchinson, J. W., Hutchinson, R. G., Sugimura, Y., and Lu, T. J., 1998, “A Technical Cost Framework for High Temperature Manufacturing of Small Components and Devices,” J. Am. Ceram. Soc., in press.
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
|
|