Tiny, Tuned, and Unattached

Abstract

Work is under way to create high-end integrated microsystems that can sense, crunch data, and communicate wirelessly—in a package the size of a sugar cube. Research is under way to bring wireless communication down to the micro level, laying the groundwork for next-generation sensing systems. Wireless sensors assume low manufacturing costs, low power use, and an elevated level of integration. Power dissipation must be low enough to permit an acceptable lifetime for the device. One effort working to make this vision a reality is the Wireless Integrated Microsystems (WIMS) project—a research consortium funded by the National Science Foundation (NSF). WIMS is one of about 20 Engineering Research Centers funded by the NSF and is the only one focused on wireless microelectro-mechanical system (MEMS) devices. The NSF has pledged financial support for up to 10 years.