Thermofluid Design of Single-Phase Submerged-Jet Impingement Cooling for Electronic Components
Author:
Affiliation:
1. 3M ICPD, St. Paul, MN 55144-1000
2. University of Minnesota, Minneapolis, MN
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/116/3/237/5663390/237_1.pdf
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Single and Double-Sided Jet Impingement Cooling for SiC-Based Power Modules;2023 IEEE 10th Workshop on Wide Bandgap Power Devices & Applications (WiPDA);2023-12-04
2. Integration of Jet Impingement Cooling With Direct Bonded Copper Substrates for Power Electronics Thermal Management;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-02
3. A REVIEW ON COOLING OF DISCRETE HEATED MODULES USING LIQUID JET IMPINGEMENT;Frontiers in Heat and Mass Transfer;2018-07-04
4. Boiling Heat Transfer From an Array of Round Jets With Hybrid Surface Enhancements;Journal of Heat Transfer;2015-07-01
5. Investigation of heat transfer processes involved liquid impingement jets: a review;Brazilian Journal of Chemical Engineering;2013-09
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