A Technique for Processing Transient Heat Transfer, Liquid Crystal Experiments in the Presence of Lateral Conduction
Author:
Ling John P. C. W.1, Ireland Peter T.1, Turner Lynne2
Affiliation:
1. Department of Engineering Science, University of Oxford, Parks Road, Oxford, OX1 3PJ, UK 2. Rolls-Royce plc., P.O. Box 3, Filton, Bristol, BS34 7QE, UK
Abstract
New techniques for processing transient liquid crystal heat transfer experiment have been developed. The methods are able to measure detailed local heat transfer coefficient and adiabatic wall temperature in a three temperature system from a single transient test using the full intensity history recorded. Transient liquid crystal processing methods invariably assume that lateral conduction is negligible and so the heat conduction process can be considered one-dimensional into the substrate. However, in regions with high temperature variation such as immediately downstream of a film-cooling hole, it is found that lateral conduction can become significant. For this reason, a procedure which allows for conduction in three dimensions was developed by the authors. The paper is the first report of a means of correcting data from the transient heat transfer liquid crystal experiments for the effects of significant lateral conduction. The technique was applied to a film cooling system as an example and a detailed uncertainty analysis performed.
Publisher
ASME International
Subject
Mechanical Engineering
Reference31 articles.
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