Investigation of Heat Source Layout Optimization by Using Deep Learning Surrogate Models

Author:

Lang Ji12,Wang Qianqian12,Tong Shan34

Affiliation:

1. Jiangsu, Key Laboratory for Design and Manufacture of Micro-Nano Biomedical Instruments, School of Mechanical Engineering, Southeast University , Nanjing 211189, China

2. Southeast University

3. MOE, Key Laboratory of Soft Soils and Geoenvironmental Engineering, College of Civil Engineering and Architecture, Zhejiang University , Hangzhou 310058, China

4. Zhejiang University

Abstract

Abstract The heat source layout optimization (HSLO) is typically used to facilitate superior heat dissipation in thermal management. However, HSLO is characterized by numerous degrees-of-freedom and complex interrelations between components. Conventional optimization methodologies often exhibit limitations such as high computational demands and diminished efficiency, particularly for complex scenarios. This study demonstrates the application of deep learning surrogate models based on the feedforward neural network (FNN) to optimize heat source layouts. These models provide rapid and precise evaluations, with diminished computational loads and enhanced efficiency of HSLO. The proposed approach integrates coarse and fine search modules to traverse the layout space and pinpoint optimal configurations. Parametric examinations are taken to explore the impact of refinement grades and conductive ratios, which dominate the optimization problem. The pattern changes of the conductive channel have been presented. Moreover, the critical conductive ratio has been found, below which the conductive material can no longer contribute to heat dissipation. The outcomes elucidate the fundamental mechanisms of HSLO, providing valuable insights for thermal management strategies.

Funder

National Natural Science Foundation of China

Natural Science Foundation of Jiangsu Province

Publisher

ASME International

Reference41 articles.

1. A Review on Transient Thermal Management of Electronic Devices;ASME J. Electron. Packag.,2022

2. Ultrahigh-Efficient Material Informatics Inverse Design of Thermal Metamaterials for Visible-Infrared-Compatible Camouflage;Nat. Commun.,2023

3. A Review of the State-of-the-Art in Electronic Cooling;E-Prime - Adv. Electr. Eng. Electron. Energy,2021

4. Managing Heat for Electronics;Mater. Today,2005

5. Thermal Camouflaging Metamaterials;Mater. Today,2021

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