Optimization of the Powder Injection Molding Process Parameters Using the Sequential Simplex Algorithm and Sensitivity Analysis

Author:

Keshavarz Panahi Ali1,Mianajiy Hadi,Miandoabchi Elyar,Hussaini Fareed Mohamad2

Affiliation:

1. e-mail:

2. School of Mechanical Engineering, Iran University of Science and Technology, Tehran 16846, Iran

Abstract

In this work, the minimization of warpage was investigated using the “moldflow” software and sequential simplex algorithm based on feedstock properties. Also, the sensitivity analysis was implemented to determine the degree of impact of each parameter on the warpage. This study is divided into two portions: experimental analysis and numerical analysis. First, for the experimental study, four kinds of feedstock with different alumina powder loadings were prepared to investigate the rheological properties. This investigation showed that the feedstock with 60 vol. % alumina powder was the optimum feedstock for the injection molding. Also, the results indicated that the viscosity of feedstock decreases by increasing both the shear rate and temperature. Next, the thermal conductivity of this feedstock was measured at different temperatures and it was found that the change of temperature can greatly influence the thermal conductivity of feedstock. In the numerical study, the injection molding parameters were divided into three categories. Based on the feedstock properties obtained form the first portion, and in order to minimize the warpage, the values of these parameters were sequentially acquired by moldflow and used in the sequential simplex algorithm for gradual convergence to the optimum level. To show the accuracy of numerical results, several samples were injection molded using the injection molding conditions for each vertex; results showed a close correlation between the values obtained by the numerical simulation and by the actual case. After determining the optimum parameter values, the sensitivity analysis was performed to identify the level of influence of each parameter on warpage. The obtained results showed that the most effective parameters on warpage are the mold temperature, packing pressure, and the holding time. Generally, it is demonstrated that the experimental and numerical analysis, performed via the moldflow software and sequential simplex algorithm, together with the sensitivity analysis can be useful in achieving success in the powder injection molding (PIM) technique.

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3