Stress Concentration in Low-Porosity Periodic Tessellations With Generic Patterns of Elliptical Holes Under Biaxial Strain

Author:

Leng Jiazhen1,Reynolds Gerard2,Schaenzer Megan3,Pham Minh Quan3,Bourgeois Genevieve3,Shanian Ali3,Pasini Damiano1

Affiliation:

1. Mem. ASME Department of Mechanical Engineering, McGill University, 817 Sherbrooke Street West, Montreal, QC H3A 0C3, Canada e-mail:

2. Department of Mechanical Engineering, McGill University, 817 Sherbrooke Street West, Montreal, QC H3A 0C3, Canada e-mail:

3. Siemens Power and Gas, 9545 Côte-de-Liesse, Dorval, QC H9P 1A5, Canada e-mail:

Abstract

Stress concentration in porous materials is one of the most crucial culprits of mechanical failure. This paper focuses on planar porous materials with porosity less than 5%. We present a stress-prediction model of an arbitrarily rotated elliptical hole in a rhombus shaped representative volume element (RVE) that can represent a class of generic planar tessellations, including rectangular, triangular, hexagonal, Kagome, and other patterns. The theoretical model allows the determination of peak stress and distribution of stress generated near the edge of elliptical holes for any arbitrary tiling under displacement loading and periodic boundary conditions. The results show that the alignment of the void with the principal directions minimizes stress concentration. Numerical simulations support the theoretical findings and suggest the observations remain valid for porosity as large as 5%. This work provides a fundamental understanding of stress concentration in low-porosity planar materials with insight that not only complements classical theories on the subject but also provides a practical reference for material design in mechanical, aerospace, and other industry.

Funder

Natural Sciences and Engineering Research Council of Canada

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Generalized tessellations of superellipitcal voids in low porosity architected materials for stress mitigation;Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences;2021-02

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