Investigation of Thermo-Elastic Behavior of Multidisk Clutches

Author:

Abdullah Oday I.1,Akhtar Mumtaz Jamil2,Schlattmann Josef1

Affiliation:

1. System Technologies and Engineering Design Methodology, Hamburg University of Technology, Denickestrasse 17 (Building L), Hamburg 21073, Germany e-mail:

2. System Technologies and Engineering Design Methodology, Hamburg University of Technology, Denickestrasse 17 (Building L), Hamburg 21073, Germany

Abstract

The high thermal stresses generated in the contacting surfaces of a multidisk clutch system (pressure plate, clutch disks, plate separators and piston), due to the frictional heating generation during the slipping, is considered to be one of the main reasons lead to premature failure in the contacting surfaces of clutches. A finite element technique has been used to study the transient thermo-elastic phenomena of multidisk dry clutch. The effect of the sliding speed on the contact pressure distribution, the temperature field and the frictional heat generated along the frictional surfaces are investigated. Analysis has been completed using axisymmetric model to simulate the multidisk clutch system. Ansys software has been used to perform the numerical calculation in this paper.

Publisher

ASME International

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials

Reference19 articles.

1. Transient Solution of the Unperturbed Thermoelastic Contact Problem;J. Therm. Stresses,2009

2. Experimental Characterization of Wet Clutch Friction Behaviors Including Thermal Dynamics,2009

3. Thermoelastic Instability in Friction Clutches And Brakes–Transient Modal Analysis Revealing Mechanisms of Excitation of Unstable Modes;Int. J. Solids Struct.,2009

4. On the Growth Rate of Thermoelastic Instability;ASME J. Tribol.,2004

5. Ma, B., Zhang, Y. F., and Li, H. Y., 2009, “Simulation and Experimental Studies on the Temperature Field of a Wet Shift Clutch During One Engagement,” IEEEInternational Computational Intelligence and Software Engineering (CiSE 2009), Wuhan, China, Dec. 11–13, pp. 1–5.10.1109/CISE.2009.5365857

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