Investigation of Lightpipe Volumetric Radiation Effects in RTP Thermometry

Author:

Frankman David J.1,Webb Brent W.1,Jones Matthew R.1

Affiliation:

1. Department of Mechanical Engineering, Brigham Young University, Provo, UT 84602-4201

Abstract

A major obstacle to the widespread implementation of rapid thermal processing (RTP) is the challenge of wafer temperature measurement. Frequently, lightpipe radiation thermometers are used to measure wafer temperatures in RTP reactors. While the lightpipe distorts the wafer temperature profile less than temperature measurement techniques which require physical contact, the presence of the lightpipe influences the wafer temperature profile. This paper presents the results of a theoretical study exploring that influence for an idealized RTP reactor in which the wafer is treated as a nonconducting, opaque, constant-heat-flux surface imaged by the lightpipe. The coupled radiation/conduction transport in the lightpipe measurement enclosure is solved numerically. Radiation transfer in the system is modeled with varying levels of rigor, ranging from a simple volumetrically nonparticipating treatment to a full spectral solution of the radiative transfer equation. The results reveal a rather significant effect of the lightpipe on the wafer temperature, which depends on the separation between the lightpipe tip and the wafer. The study illustrates clearly the need to model the lightpipe as a volumetrically participating, semitransparent medium, and further, the importance of accounting for spectral variation of the lightpipe properties in the prediction of the radiative transfer. Finally, two primary mechanisms are identified by which the lightpipe affects the wafer temperature distribution.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference14 articles.

1. Rapid Thermal Processing—A Justification;Fair

2. An Effective Emissivity Model for Rapid Thermal Processing Using the Net-Radiation Method;Zhang;Int. J. Thermophys.

3. Lightpipe Proximity Effects on Si Wafer Temperature in Rapid Thermal Processing Tools;Kreider

4. The UT/NIST/SA/ISMT Thermometry Test Bed - 2001;Ball

5. Modeling of a Radiative RTP-Type Furnace Through Inverse Design: Mathematical Model and Experimental Results;Gamba

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