Effects of Thickness on Thermal Stresses in a Thin Solder or Adhesive Layer-Reference-Cited by-同舟云学术

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Effects of Thickness on Thermal Stresses in a Thin Solder or Adhesive Layer

Published:1992-06-01 Issue:2 Volume:114 Page:199-202
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Kuo An-Yu¹,Chen Kuan-Luen¹

Affiliation:

1. Structural Integrity Associates, Inc., San Jose, CA 95118

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/114/2/199/5667006/199_1.pdf

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A study of partial layout of adhesive on the thermal drift of MEMS capacitive accelerometers;International Journal of Modern Physics B;2017-03-19

2. Investigation of the Thermal Drift of MEMS Capacitive Accelerometers Induced by the Overflow of Die Attachment Adhesive;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-05

3. Thermal stress analysis and design optimization of direct chip attach (DCA) and chip scale package (CSP) in flip chip technology;Engineering Optimization;2002-01

4. Two-Dimensional Thermal Stress Analysis of Surface Mount Joints under Uniform Temperature Change;JSME international journal. Ser. A, Mechanics and material engineering;1995-10-15

5. Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging;Journal of Electronic Packaging;1995-09-01

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