Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint-Reference-Cited by-同舟云学术

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Published:2021-01-19 Issue:3 Volume:143 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Liu Yang¹,Li Zhao²,Zhou Min³,Zeng Xianghua¹,Sun Fenglian⁴

Affiliation:

1. College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou 225127, China

2. College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou 225127, China; School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China

3. College of Physical Science and Technology, Institute of Optoelectronic Technology, Yangzhou University, Yangzhou 225002, China

4. School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China

Abstract

Abstract Cu foam (Cu-F) and Ag-coated Cu-F were added into nano-Ag paste to obtain Cu-F@nano-Ag composite sintered joint. The microstructure, hardness, and shear behavior of the sintered joints were investigated. Experimental results indicated that the addition of Cu-F and Ag-coated Cu-F suppressed the generation and propagation of cracks at the interface of the sintered joint. As the thickness of the Cu-F increased from 0.1 mm to 0.2 mm, the deformation ratio of the Cu-F sheet raised from 12% to 50%. Thereby, the hardness and bonding strength of the sintered joint was improved due to the microstructural densification. The bonding quality between Cu-F and sintered Ag is enhanced by the Ag-coating treatment. Therefore, the Ag-coated composite joints show higher shear strength than the others.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4049128/6622947/ep_143_03_031002.pdf

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