Microelectronics Packaging Handbook-Reference-Cited by-同舟云学术

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Microelectronics Packaging Handbook

Published:1989-09-01 Issue:3 Volume:111 Page:241-242
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Tummala Rao R.,Rymaszewski Eugene J.,Lee Y. C.¹

Affiliation:

1. AT&T Bell Laboratories, Murray Hill, NJ 07974

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/111/3/241/5677132/241_1.pdf

Cited by 36 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Influence of nickel plating on the welding metallurgical mechanism, microstructure, and shear performance of C101/80Au20Sn/C101 solder joints;Materials Characterization;2024-09

2. A review on improved physical and thermal properties of oxide nanoparticles reinforced epoxy composites;Zastita Materijala;2024-03-15

3. Toward Ultrasonic Wire Bonding for High Power Device: A Vector Based Resonant Frequency Tracking and Constant Amplitude Control;IEEE Transactions on Automation Science and Engineering;2023-04

4. Low Temperature Au/Sn Solid-Liquid Diffusion Chip-to-Chip Bonding for MEMS Encapsulation;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

5. In situ FTIR analysis for the determination of imidization degree of polyimide precursors;Polymer;2022-01

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