Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling

Author:

Leon Octavio1,De Mey Gilbert1,Dick Erik2,Vierendeels Jan2

Affiliation:

1. Department of Electronics and Information Systems, Ghent University, Sint Pietersnieuwstraat 41, 9000 Ghent, Belgium

2. Department of Flow, Heat, and Combustion, Ghent University, Sint Pietersnieuwstraat 41, 9000 Ghent, Belgium

Abstract

The performance of an array of staggered and nonstaggered cooling fins is compared, looking not only into the traditional objective of maximum heat transfer flux, but also to obtain it with the minimum flow resistance. Three different models were studied to obtain the ratio between the heat removed and the energy spent for the coolant flow going through the cooling fins. The study is done numerically using the computational fluid dynamic software FLUENT. The results show the advantages of the staggered model compared to the standard model since for a given incoming velocity, the use of a staggered heat sink always leads to a maximization of the heat transfer flux. The significant positive difference in the thermal performance of the staggered model permits the reduction of the incoming velocity with the consequent reduction in the pressure drop, and power consumption. The authors consider this research as a quite interesting approach as compared to other research where the flow resistance has not been taken into account.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Incropera, F. P. , 1988, “Convection Heat Transfer in Electronic Equipment Cooling,” Int. J. Heat Mass Transfer, 110, Nov., pp. 1097–1111.

2. Kin, S. J., and Lee, S. W., 1996, Air Cooling Technology for Electronic Equipment, CRC Press, New York, pp. 2–46.

3. Azar, K. , 2000, “The History of the Power Dissipation,” J. Electronics Cooling, 6(2), pp. 42–50.

4. Maling, G. C., and Yeager, D. M., 1996, “Minimizing Acoustical Noise in Electronic Systems,” J. Electronics Cooling, 2(2), pp. 14–17.

5. Soodphakdee, D., et al., 1998, “A Comparison of Heat Sink Geometries for Laminar Forced Convection: Numerical Simulation of Periodically Developed Flow,” The Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Seattle, Washington, pp. 310–315.

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