1. Incropera, F. P.
, 1988, “Convection Heat Transfer in Electronic Equipment Cooling,” Int. J. Heat Mass Transfer, 110, Nov., pp. 1097–1111.
2. Kin, S. J., and Lee, S. W., 1996, Air Cooling Technology for Electronic Equipment, CRC Press, New York, pp. 2–46.
3. Azar, K.
, 2000, “The History of the Power Dissipation,” J. Electronics Cooling, 6(2), pp. 42–50.
4. Maling, G. C., and Yeager, D. M., 1996, “Minimizing Acoustical Noise in Electronic Systems,” J. Electronics Cooling, 2(2), pp. 14–17.
5. Soodphakdee, D., et al., 1998, “A Comparison of Heat Sink Geometries for Laminar Forced Convection: Numerical Simulation of Periodically Developed Flow,” The Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Seattle, Washington, pp. 310–315.