Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique-Reference-Cited by-同舟云学术

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Published:2009-11-12 Issue:4 Volume:131 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Wang Chuen-Ching¹,Ye Yao-Ting²,Lin Jing-Fung³

Affiliation:

1. Department of Information Management, Shu-Zen College of Medicine and Management, 452 Hwan-chio Road, Luju Kaohsiung, Hsien 82144, Taiwan

2. M-Extension Electronics Corporation, No. 1 Section 3rd, Technology East Road, Qingxi Town of Dongguan City, Guangdong 523641, China

3. Department of Computer Application Engineering, Far East University, No. 49, Chung Hua Road, Hsin-Shih, Tainan County 744, Taiwan

Abstract

This study develops a novel glass cover chip (GCC) technique for the packaging of CMOS image sensors (CIS), in which the glass cover plate is attached directly to the chip using a nonconductive adhesive film. Taking the adhesive force between the glass plate and the chip as a performance indicator, a series of Taguchi trials are performed to establish the optimal GCC processing conditions. The experimental results confirm the feasibility of the proposed packaging technique and indicate a volume reduction of 59.47% compared with the traditional CIS package. Furthermore, the simulation results reveal that the heat dissipation efficiency of the proposed CIS package exceeds that of the traditional package by 245%.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4000363/5603806/041009_1.pdf

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