Three Dimensional Imaging of LIGA-Made Microcomponents

Author:

Chinn Douglas1,Ostendorp Peter2,Haugh Mike3,Kershmann Russell3,Kurfess Thomas4,Claudet Andre4,Tucker Thomas4

Affiliation:

1. Sandia National Laboratories, P.O. Box 5800, MS0603 Albuquerque, NM 87185

2. Dartmouth College, HB 8000, Hanover, NH 03755

3. Resolution Sciences Corporation, 685 Northern Ave., Mill Valley, CA 94941

4. Georgia Institute of Technology, Woodruff School of Mechanical Engineering, Atlanta, GA 30332

Abstract

Nickel and nickel-alloy microparts sized on the order of 5–1000 microns have been imaged in three dimensions using a new microscopic technique, Digital Volumetric Imaging (DVI). The gears were fabricated using Sandia National Laboratories’ LIGA technology (lithography, molding, and electroplating). The images were taken on a microscope built by Resolution Sciences Corporation by slicing the gear into one-micron thin slices, photographing each slice, and then reconstructing the image with software. The images were matched to the original CAD (computer aided design) model, allowing LIGA designers, for the first time, to see visually how much deviation from the design is induced by the manufacturing process. Calibration was done by imaging brass ball bearings and matching them to the CAD model of a sphere. A major advantage of DVI over scanning techniques is that internal defects can be imaged to very high resolution. In order to perform the metrology operations on the microcomponents, high-speed and high-precision algorithms are developed for coordinate metrology. The algorithms are based on a least-squares approach to data registration the {X,Y,Z} point clouds generated from the component surface onto a target geometry defined in a CAD model. Both primitive geometric element analyses as well as an overall comparison of the part geometry are discussed. Initial results of the micromeasurements are presented in the paper.

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

Reference27 articles.

1. Solecky, E., Archie, C., Hayes, T., Banke, B., and Cornell, R., 2001, “Three Dimensional Top Down Metrology: A Viable Alternative to AFM or Cross Section?,” Metrology, Inspection and Process Control for Microlithography XV, N. T. Sullivan, ed., Proc. SPIE, 4344, p. 366–376.

2. Russ, J. C., 2002, The Image Processing Handbook, 4th ed., CRC Press, Boca Raton, FL.

3. Udupa, J. K., and Herman, G. T., eds., 2000, 3D Imaging in Medicine, 2nd ed., CRC Press, Boca Raton, FL.

4. Osten, W., Seebacher, S., and Jeptner, W., 2001, “The Application of Digital Holography for the Inspection of Microcomponents,” Proc. SPIE, 4400, pp. 1–15. Other papers in this volume also discuss 3D imaging and measurement.

5. Franco, E., Chang, W., and Morales, A., 2002, “Non-Destructive Creation of Accurate 3D Images of MEMS Microcomponents,” unpublished results.

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