Effect of Jet Position on Cooling an Array of Heated Obstacles-Reference-Cited by-同舟云学术

Effect of Jet Position on Cooling an Array of Heated Obstacles

Published:2017-07-06 Issue:1 Volume:10 Page:
ISSN:1948-5085
Container-title:Journal of Thermal Science and Engineering Applications
language:en
Short-container-title:

Author:

Maghrabie Hussein M.¹,Attalla M.²,Fawaz H. E.³,Khalil M.⁴

Affiliation:

1. Mem. ASME Department of Mechanical Engineering, Faculty of Engineering, South Valley University, Al Shoban Al Moslemin Street, Qena 83521, Egypt e-mail:

2. Department of Mechanical Engineering, Faculty of Engineering, South Valley University, Al Shoban Al Moslemin Street, Qena 83521, Egypt e-mail:

3. Department of Mechanical Engineering, National Research Centre, 33 El Buhouth Street, Dokki, Cairo 12311, Egypt e-mail:

4. Department of Mechanical Engineering, Faculty of Engineering, Sohag University, Shark District, Sohag 82514, Egypt e-mail:

Abstract

Numerical study of the effect of jet position (JP) on cooling process of an array of heated obstacles simulating electronic components has been investigated based on realizable k–ε model. Jet positions have been changed to impinge each row of obstacles consecutively. The experiments have been achieved at three different values of jet-to-channel Reynolds number ratio, Rej/Rec = 1, 2, and 4. In this study, a comparison between two different cooling processes, cross flow only (CF) and jet impingement with cross flow (JICF), has been achieved. The flow structure, heat transfer characteristics, and the pumping power have been investigated for different jet positions. The results show that the jet position affects significantly the flow structure, as well as the heat transfer characteristics. According to the results of average heat transfer coefficient and the pumping power, the more effective jet position for all values of jet-to-channel Reynolds number ratio (1, 2, and 4) is achieved when the jets impinge the third row of obstacles (JP3).

Publisher

ASME International

Subject

Fluid Flow and Transfer Processes,General Engineering,Condensed Matter Physics,General Materials Science

Link

http://asmedigitalcollection.asme.org/thermalscienceapplication/article-pdf/doi/10.1115/1.4036788/6336269/tsea_010_01_011005.pdf

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