A Predictive Model for Variation in the Pitch Between Stamped Pilot Holes

Author:

Vallance R. Ryan1,Kiani Sepehr2

Affiliation:

1. Mechanical Engineering, University of Kentucky, Lexington, KY 40506-0108

2. Development Engineering, Teradyne Connection Systems, Nashua, NH 03060

Abstract

This paper presents an analytical model for predicting the variation in the pitch distance between pilot holes stamped with a progressive die. The model is useful in designing diesets since it relates pitch variation to dieset parameters such as the quantity of pilot pins, clearance in the stripper plate bearings, clearance about the punch, and clearance about the pilot pins. The efficacy of the predictive model is demonstrated with a sensitivity study of design parameters in an exemplary dieset used to stamp electrical contacts. Predictions from the model match previously measured variation within about twenty-four percent.

Publisher

ASME International

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Control and Systems Engineering

Reference23 articles.

1. Geiger, M., Kleiner, M., Eckstein, R., Tiesler, N., and Engel, U., 2001, “Microforming,” CIRP Ann., 50(2), pp. 445–462.

2. Kiani, S., Vallance, R. R., and Slocum, A. H., 1999, “Errors in Progressive Dies for Electronic Components,” Proceedings of the American Society for Precision Engineering 1999 Annual Meeting, American Society for Precision Engineering, Monterey, CA. pp. 49–52.

3. Jimma, T., and Sekine, F., 1987, “Precision Blanking of Electronic Machine Parts,” Advanced Technology of Plasticity 1987, Lange, K., eds., Berlin Springer, pp. 291–297.

4. Jimma, T., and Sekine, F., 1990, “On High Speed Precision Blanking of IC Lead-frames Using a Progressive Die,” J. Mater. Process. Technol., 22(3), pp. 291–305.

5. Breitling, J., Pfeiffer, B., Altan, T., and Siegert, K., 1997, “Process Control in Blanking,” Journal of Materials Processing Technology, Proceedings of the 1996 2nd International Conference on Sheet Forming Technology, 71, No. (1), pp. 187–192.

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