Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials

Author:

Chen Jiawei1ORCID,Yan Zhongming23,Qiao Yang1,Lin Feihong1,Wang Yu23,Zhou Hongcheng1

Affiliation:

1. School of Electrical Engineering, Southwest Jiaotong University , Chengdu 610031, China

2. School of Electrical Engineering, Southwest Jiaotong University , Chengdu 610031, China ; Chengdu 611756, China

3. Department of Electricity and Electronics, Key Laboratory of Magnetic Suspension Technology and Maglev Vehicle, Ministry of Education, , Chengdu 610031, China ; Chengdu 611756, China

Abstract

Abstract In this paper, a variable density topology optimization method is used to design a high thermal conductivity path structure for efficient heat dissipation. The temperature and stiffness in the module volume are taken as the objective function. Simulations are carried out to compare with a high-power electronics device heat dissipation. The heat dissipation performance (HDP) of structures optimized topologically is further enhanced through the use of auxiliary materials, including highly thermally conductive coating material and phase change material (PCM). The efficient heat dissipation of the constructed topology optimization model and the effectiveness of the proposed method are verified.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference22 articles.

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4. Large Scale Three-Dimensional Topology Optimisation of Heat Sinks Cooled by Natural Convection;Int. J. Heat Mass Transfer,2016

5. Industrial Application of Topology Optimization for Combined Conductive and Convective Heat Transfer Problems;Struct. Multidiscip. Optim.,2016

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