Organic Piezoresistive Pressure Sensitive Robotic Skin for Physical Human-Robot Interaction

Author:

Wei Danming1,Zhang Ruoshi1,Saadatzi Mohammad N.1,Olowo Olalekan O.1,Popa Dan O.1

Affiliation:

1. University of Louisville

Abstract

Abstract Pressure sensitive robotic skins have long been investigated for applications to physical human-robot interaction (pHRI). Numerous challenges related to fabrication, sensitivity, density, and reliability remain to be addressed under various environmental and use conditions. In our previous studies, we designed novel strain gauge sensor structures for robotic skin arrays. We coated these star-shaped designs with an organic polymer piezoresistive material, Poly (3, 4-ethylenedioxythiophene)-ploy(styrenesulfonate) or PEDOT: PSS and integrated sensor arrays into elastomer robotic skins. In this paper, we describe a dry etching photolithographic method to create a stable uniform sensor layer of PEDOT:PSS onto star-shaped sensors and a lamination process for creating double-sided robotic skins that can be used with temperature compensation. An integrated circuit and load testing apparatus was designed for testing the resulting robotic skin pressure performance. Experiments were conducted to measure the loading performance of the resulting sensor prototypes and results indicate that over 80% sensor yields are possible with this fabrication process.

Publisher

American Society of Mechanical Engineers

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Design and Fabrication of an Aerosol Jet Printed Tactile Sensor on Flexible Substrate;IEEE Journal on Flexible Electronics;2023-03

2. SkinCell: A Modular Tactile Sensor Patch for Physical Human–Robot Interaction;IEEE Sensors Journal;2023-02-01

3. Automated Fabrication of Tactile Sensors Using a Custom Additive Manufacturing Platform;2022 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS);2022-07-25

4. PEDOT: PSS Polymer Aerosol Jet-printing for Robotic Skin Sensors;2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS);2022-07-10

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