High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
Author:
Affiliation:
1. School of Integrated Circuits, Tsinghua University , Beijing 100084, China
2. Zhongwei High-tech Electronics Co. Ltd. , Wuxi, Jiangsu 214000, China
Abstract
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
https://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/145/3/031009/6995685/ep_145_03_031009.pdf
Reference24 articles.
1. Bandwidth and Gain Enhancement of Antenna in Package,2012
2. A Highly Integrated 60 GHz 6-Channel Transceiver With Antenna in Package for Smart Sensing and Short-Range Communications;IEEE J. Solid-State Circuits,2016
3. Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology;IEEE Sens. J.,2016
4. A 76-to-81 GHz 2 × 8 FMCW MIMO Radar Transceiver With Fast Chirp Generation and Multi-Feed Antenna-in-Package Array,2021
5. A Hybrid Antenna in Package Solution Using FOWLP Technology;ASME J. Electron. Packag.,2022
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