Reliability Considerations for Oil Immersion-Cooled Data Centers

Author:

Shah Jimil M.1,Eiland Richard2,Rajmane Pavan3,Siddarth Ashwin2,Agonafer Dereje2,Mulay Veerendra4

Affiliation:

1. Department of Mechanical and Aerospace Engineering, University of Texas at Arlington, P.O. Box 19023, Arlington, TX 76013 e-mail:

2. Department of Mechanical and Aerospace Engineering, University of Texas at Arlington, P.O. Box 19023, Arlington, TX 76013

3. Department of Mechanical and Aerospace Engineering, University of Texas at Arlington, P.O. Box 19023, Arlington, TX 76013

4. Facebook, Inc., Menlo Park, CA 425081

Abstract

The improved efficiency of mineral oil may offer simplicity in facility design compared to traditional air cooling and provide a means for cost savings. Despite its improved cooling efficiency and cost savings, a mineral oil immersion cooling technique is still not widely implemented and original equipment manufacturers are reluctant to jeopardize sales of existing air-based cooling system equipment. Only compelling physics regarding thermal performance of direct immersion cooling is not enough for data center operators. Many uncertainties and concerns persist regarding the effects of mineral oil immersion cooling on the reliability of information technology (IT) equipment both at the component and chassis level. This paper is a first attempt at addressing this challenge by reviewing the changes in physical and chemical properties of IT equipment materials like polyvinyl chloride (PVC), printed circuit board (PCB), and capacitors and characterizes the interconnect reliability of materials. The changes in properties of a mineral oil like kinematic viscosity and dielectric strength are also cited as important factors and discussed briefly. The changes in mechanical properties like elasticity, hardness, swelling, and creep are being shown in the paper for thermoplastic materials. The chemical reaction between material and mineral oil as a function of time and temperature is also conferred. The literature gathered on the subject and quantifiable data gathered by the authors provide the primary basis for this research document.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3