Reliability Considerations for Oil Immersion-Cooled Data Centers

Author:

Shah Jimil M.1,Eiland Richard2,Rajmane Pavan3,Siddarth Ashwin2,Agonafer Dereje2,Mulay Veerendra4

Affiliation:

1. Department of Mechanical and Aerospace Engineering, University of Texas at Arlington, P.O. Box 19023, Arlington, TX 76013 e-mail:

2. Department of Mechanical and Aerospace Engineering, University of Texas at Arlington, P.O. Box 19023, Arlington, TX 76013

3. Department of Mechanical and Aerospace Engineering, University of Texas at Arlington, P.O. Box 19023, Arlington, TX 76013

4. Facebook, Inc., Menlo Park, CA 425081

Abstract

The improved efficiency of mineral oil may offer simplicity in facility design compared to traditional air cooling and provide a means for cost savings. Despite its improved cooling efficiency and cost savings, a mineral oil immersion cooling technique is still not widely implemented and original equipment manufacturers are reluctant to jeopardize sales of existing air-based cooling system equipment. Only compelling physics regarding thermal performance of direct immersion cooling is not enough for data center operators. Many uncertainties and concerns persist regarding the effects of mineral oil immersion cooling on the reliability of information technology (IT) equipment both at the component and chassis level. This paper is a first attempt at addressing this challenge by reviewing the changes in physical and chemical properties of IT equipment materials like polyvinyl chloride (PVC), printed circuit board (PCB), and capacitors and characterizes the interconnect reliability of materials. The changes in properties of a mineral oil like kinematic viscosity and dielectric strength are also cited as important factors and discussed briefly. The changes in mechanical properties like elasticity, hardness, swelling, and creep are being shown in the paper for thermoplastic materials. The chemical reaction between material and mineral oil as a function of time and temperature is also conferred. The literature gathered on the subject and quantifiable data gathered by the authors provide the primary basis for this research document.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Thermal Robust Design Considerations for a Forced Convection Immersion Tank;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27

2. Natural and forced convection heat transfer characteristics of single-phase immersion cooling systems for data centers;International Journal of Heat and Mass Transfer;2023-06

3. Performance analysis of single-phase immersion cooling system of data center using FC-40 dielectric fluid;International Communications in Heat and Mass Transfer;2023-06

4. An investigation of multi-parameters effects on the performance of liquid-to-liquid heat exchangers in rack level cooling;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

5. Study on heat transfer performance of immersion system based on SiC/white mineral oil composite nanofluids;International Journal of Thermal Sciences;2023-05

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