Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Author:

O'Connor Nathaniel J.1,Castaneda Alexander J.1,Christidis Pavolas N.1,Vayas Tobar Nicolas1,Talmor Michal1,Yagoobi Jamal1

Affiliation:

1. Multiscale Heat Transfer Laboratory, Worcester Polytechnic Institute, 100 Institute Rd., Worcester, MA 01609

Abstract

Abstract As modern-day electronics develop, electronic devices become smaller, more powerful, and are expected to operate in more diverse configurations. However, the thermal control systems that help these devices maintain stable operation must advance as well to meet the demands. One such demand is the advent of flexible electronics for wearable technology, medical applications, and biology-inspired mechanisms. This paper presents the design and performance characteristics of flexible electrohydrodynamic (EHD) pumps, based on EHD conduction pumping technology in macro- and mesoscales. Unlike mechanical pumps, EHD conduction pumps have no moving parts, can be easily adjusted to the microscale, and have been shown to generate and control the flow of refrigerants for electronics cooling applications. However, these pumping devices have only been previously tested in rigid configurations unsuitable for use with flexible electronics. In this work, for the first time, the net flow generated by flexible EHD conduction pumps is measured on a flat plane in various configurations. In this study, the results show that the flexible EHD conduction pumps are capable of generating significant flow velocities in all size scales considered in this study, with and without bending. This study also proves the viability of screen printing as a manufacturing method for these pumps. The selection of working fluid for EHD conduction pumping is also a topic of discussion. Novec Engineered Fluids have been a popular choice for EHD pumping; however, long-term testing has shown that some Novec fluids degrade over time.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Theoretical/Numerical Study of Electrohydrodynamic Pumping Through Conduction Phenomenon;IEEE Trans. Ind. Appl.,2003

2. Electrohydrodynamically Induced Dielectric Liquid Flow Through Pure Conduction in Point/Plane Geometry;IEEE Trans. Dielectrics Electr. Insul.,2003

3. Recent Experimental Advances in Electrohydrodynamic Conduction Pumping Research,2014

4. Heat Transport Enhancement of Monogroove Heat Pipe With Electrohydrodynamic Pumping;J. Thermophys. Heat Transfer,1997

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