Effect of Geometry and Materials on Residual Stress Measurement in Thin Films by Using the Focused Ion Beam

Author:

Kang Ki-Ju1,Darzens Severine2,Choi Gee-Seob1

Affiliation:

1. Department of Mechanical Engineering, Chonnam National University, Kwangju, 500-757, Korea

2. Princeton Materials Institute, Princeton University, Princeton, NJ 08540

Abstract

Recently, a new method for residual stress measurement in thin films by using the focused ion beam (FIB) has been proposed by the authors. It is based on the combined capability of the FIB imaging system and of high-resolution strain mapping software (VIC-2D). A simple equation based on two-dimensional elasticity is used to evaluate the residual stress from the displacements due to introducing a slot. The slot length is assumed to be much larger than the slot width or depth. And the effect of the slot width was neglected. However, it is often hard, depending on film materials, to introduce a narrow and deep slot by FIB. In this work some practical issues regarding the slot geometry are addressed. Through two- and three-dimensional finite element analyses, it is explored how the slot length, width and measurement location affect the displacements which are the basic data for residual stress evaluation. As a result, the validity and limit of the equations based on two-dimensional elasticity are evaluated. Also, the effect of material dissimilarity between film and substrate is explored. Finally, examples for a diamond-like carbon film on glass substrate and an aluminum oxide film thermally grown upon an alloy are presented.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference32 articles.

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4. Cheng, W., and Finnie, I., 1993, “Measurement of Residual Stresses Distributions Near the Toe of an Attachment Welded on a Plate Using the Crack Compliance Method,” Eng. Fract. Mech., 46, pp. 79–92.

5. Cheng, W., Finnie, I., and Prime, M. B., 1992, “Measurement of Residual Stresses Through the Thickness of a Strip Using the Crack-Compliance Method,” Residual Stresses—III Science and Technology, edited by H. Fujiwara, T. Abe, and K. Tanaka, Elsevier, Amsterdam, 2, pp. 1127–1132.

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