Numerical and Experimental Investigations of the Head/Tape Interface in a Digital Linear Tape Drive
Author:
Tan Sanwu1, Talke Frank E.1
Affiliation:
1. CMRR, University of California, San Diego, La Jolla, CA 92093-0401
Abstract
Finite element analysis is applied to simulate the head/tape interface in a Digital Linear Tape (DLT) drive. The numerical model was verified by contact spacing measurements using a “three-bump” glass head and three-wavelength interferometry. The effect of tape speed, tension and head contour parameters (island width, island radius, and penetration) on the head/tape spacing is investigated numerically for a three-bump and a five-bump DLT-type head. A “Local Tape Wrap Angle” is defined to characterize the head/tape interface.
Publisher
ASME International
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials
Reference20 articles.
1. Hahn, F.
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