Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste-Reference-Cited by-同舟云学术

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Published:2019-05-24 Issue:4 Volume:141 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Cheng Hao¹,Peng Yang¹,Mou Yun¹,Sun Qinglei¹,Chen Mingxiang²

Affiliation:

1. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

2. School of Mechanical Science and Engineering; State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China e-mail:

Abstract

In this work, an easy and low-temperature fabrication method of three-dimensional (3D) ceramic substrate was proposed. A 3DPC ceramic substrate was fabricated by molding alkali-activated aluminosilicate cement (AAAC) to form up a dam (cavity) on direct plated copper (DPC) ceramic substrate at low temperature. The effects of viscosity and curing temperature of cement paste on the properties of the 3DPC were investigated. The prepared 3DPC ceramic substrate achieved precise dimensions and structure, especially the manufacturing accuracy error was less than 2.5%. By optimizing process parameters, the shear strength between dam and DPC substrate reached up to 9.5 MPa. Moreover, thermal cycle and heat resistance tests confirmed that 3DPC exhibits excellent thermal reliability. All experimental results demonstrated that 3DPC ceramic substrate could satisfy with three dimension packaging and integration.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4043645/6394747/ep_141_04_041003.pdf

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