Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components-Reference-Cited by-同舟云学术

Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

Published:1991-09-01 Issue:3 Volume:113 Page:244-249
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Wong Tin-Lup¹,Stevens Karl K.¹,Wang Gang²

Affiliation:

1. Department of Mechanical Engineering, Florida Atlantic University, Boca Raton, FL 33431

2. Dyna-Air Corporation, Fort Lauderdale, FL 33304

Abstract

Use of modal testing and structural dynamic modification techniques for prediction of the modal parameters of a PC board with a surface-mount component is described. Experimentally determined natural frequencies and mode shapes of a PC board with and without an added component are presented. Several simple dynamic models of the component are evaluated. Results obtained indicate that the component can sometimes be modeled as a point mass.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/113/3/244/5536291/244_1.pdf

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