Affiliation:
1. BMW Rolls-Royce GmbH, Dahlewitz, Germany
2. Whittle Laboratory, University of Cambridge, Cambridge, United Kingdom
Abstract
The endwall film-cooling cooling configuration investigated by Friedrichs et al. (1996, 1997) had in principle sufficient cooling flow for the endwall, but in practice, the redistribution of this coolant by secondary flows left large endwall areas uncooled. This paper describes the attempt to improve upon this datum cooling configuration by redistributing the available coolant to provide a better coolant coverage on the endwall surface, while keeping the associated aerodynamic losses small. The design of the new, improved cooling configuration was based on the understanding of endwall film-cooling described by Friedrichs et al. (1996, 1997). Computational fluid dynamics were used to predict the basic flow and pressure field without coolant ejection. Using this as a basis, the above-described understanding was used to place cooling holes so that they would provide the necessary cooling coverage at minimal aerodynamic penalty. The simple analytical modeling developed by Friedrichs et al. (1997) was then used to check that the coolant consumption and the increase in aerodynamic loss lay within the limits of the design goal. The improved cooling configuration was tested experimentally in a large-scale, low-speed linear cascade. An analysis of the results shows that the redesign of the cooling configuration has been successful in achieving an improved coolant coverage with lower aerodynamic losses, while using the same amount of coolant as in the datum cooling configuration. The improved cooling configuration has reconfirmed conclusions from Friedrichs et al. (1996, 1997): First, coolant ejection downstream of the three-dimensional separation lines on the endwall does not change the secondary flow structures; second, placement of holes in regions of high static pressure helps reduce the aerodynamic penalties of platform coolant ejection; finally, taking account of secondary flow can improve the design of endwall film-cooling configurations.
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