Affiliation:
1. Department of Mechanical Engineering, University of Puerto Rico-Mayaguez, Mayaguez, PR 00681-9045
Abstract
The development of a mathematical model of the soldering process of actual pastes as used in surface mount technology (SMT) lines is described in this paper. The coupled heat transfer processes between the solder paste and the flux including changes in solder paste properties are considered in the model. Specifically, the loss of solvents in the vehicle system, melting, solidification and further single phase cooling of the solder paste are contemplated in the model. Experiments were conducted with the objective of validating the predictions of the solder paste temperature profile and of the loss of weight due to flux extraction. Results are shown in this paper for typical eutectic paste 63%Sn-37%Pb and experimental data is in good agreement with the numerical predictions. Simulations using the lead-free solder paste systems 96.5%Sn-3.5%Ag and 42%Sn-58%Bi are also reported in this paper. The proposed model is suitable for incorporation into existing three dimensional heat transfer models of PCBs for simulations in ovens with similar characteristics as those used in actual manufacturing applications.
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. Hwang, J. S., 1996, Modern Solder Technology for Competitive Electronics Manufacturing. Sec. 7.1. pp. 209, Sec. 8.2.3. pp. 231, The McGraw-Hill Co., New York, NY.
2. Chen, S.-W., C.-C. Lin, and C. C. Chen, 1997, Determination of the melting and solidification characteristics of solders using differential scanning calorimetry. Metallurgical and Materials Transactions. Vol. 29A, pp. 1965–1972.
3. King, C., and T. S. Ong, 1993, Development of a no-clean solder paste. Circuit World. Vol. 19, No. 4. pp. 44–47.
4. Pe´rez, H., A. Marrero, and J. E. Gonzalez, 1999, Study of the thermal behavior of PCB’s during reflow in SMT lines. Proceedings of the 5th ASME/JSME Joint Thermal Engineering Conference, San Diego, California, March 15–19.
5. Manko, H. H., 1986, Soldering Handbook for Printed Circuits and Surface Mounting. The Van Nostrand Reinhold Company Inc., New York, NY. Pp. 182.
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献