Determination of Biaxial Residual Stresses by a Holographic-Hole Drilling Technique

Author:

Makino A.1,Nelson D. V.1,Fuchs E. A.2,Williams D. R.2

Affiliation:

1. Department of Mechanical Engineering, Stanford University, Stanford, CA 94305-4021

2. Sandia National Laboratories, Livermore, CA 94551-0969

Abstract

A technique is described for the rapid determination of residual stresses through the combined use of hole drilling and holographic interferometry. A small diameter blind hole is drilled into a part containing residual stresses and the displacement field caused by localized stress relief is registered using holographic interferometry instead of a strain gage rosette. The optical interference fringe pattern created in the hologram upon release of stress is analyzed by a fringe counting method that allows stresses to be computed quickly. A comparison of stresses determined by the holographic hole drilling technique with different known biaxial residual stresses is shown.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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