Adhesion and Reliability of Epoxy/Glass Interfaces
Author:
Ritter John E.1, Huseinovic Armin1
Affiliation:
1. Mechanical and Industrial Engineering Department, University of Massachusetts, Amherst, MA 01003-2210
Abstract
The reliability of microelectronic components is profoundly influenced by the fracture resistance of the polymer/inorganic interfaces and by the progressive debonding of these interfaces in aqueous environments. Consequently, fatigue (slow) crack growth in epoxy/glass interfaces bonded with the silane coupling agent 3-aminopropyltriethoxysilane (3-APES) was studied under static and cyclic loading at 23°C and in either dry or humid conditions using the double cleavage drilled compression (DCDC) test. Crack growth rates under cyclic loading were significantly greater than under static loading, indicating that stress corrosion effects are negligible and that crack tip plasticity controls cyclic fatigue crack growth at silane (3-APES) bonded epoxy/glass interfaces. After aging at 94°C in water, these silane bonded epoxy/glass interfaces exhibited somewhat greater resistance to cyclic fatigue crack growth than the unaged samples; however, after aging at 98°C in water cyclic fatigue crack growth became cohesive and fractal in nature. Mechanisms for fatigue crack growth at silane (3-APES) bonded epoxy/glass interfaces are discussed.
Publisher
ASME International
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Turner, M. R., Dalgleish, B. J., Yitte, M., and Evans, A. G., 1995, “A Fracture Resistance Measurement Method for Bimaterial Interfaces Having Large Debond Energy,” Acta Metall. Mater., 43, pp. 3459–3465. 2. Ritter, J. E., Fox, J. R., Hutko, D. I., and Lardner, T. J., 1998, “Moisture-assisted Crack Growth at Epoxy-Glass Interfaces,” J. Mater. Sci., 33, pp. 4581–4588. 3. Ritter, J. E., Learned, J. C., Ja´come, G. S., Russell, T. P., and Lardner, T. J., 1999, “Fatigue and Durability of Silane Bonded Epoxy/Glass Interfaces,” Mater. Res. Soc. Symp. Proc., 563, pp. 291–295. 4. He, M. Y., Turner, M. R., and Evans, A. G., 1995, “Analysis of the Double Cleavage Drilled Compression Specimen for Interface Fracture Energy Measurements Over a Range of Mode Mixities,” Acta Metall. Mater., 43, pp. 3453–3458. 5. Suo, Z., and Hutchinson, J. W., 1989, “Sandwich Test Specimens for Measuring Interface Crack Toughness,” Mater. Sci. Eng., A107, pp. 135–143.
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
|
|